Cookies on this website

We use cookies to ensure that we give you the best experience on our website. If you click 'Accept all cookies' we'll assume that you are happy to receive all cookies and you won't see this message again. If you click 'Reject all non-essential cookies' only necessary cookies providing core functionality such as security, network management, and accessibility will be enabled. Click 'Find out more' for information on how to change your cookie settings.

© 2016 IEEE. This paper demonstrates a new approach to model the impact of thermal effects on the efficiency of integrated voltage regulators (IVRs) by combining analytical efficiency evaluations with coupled electrical and thermal simulations. An application of the approach shows that a system-in-package solution avoids thermal problems typically observed in other IVR designs. While the evaluation in this paper focuses on the thermal impact on loss in the inductor wiring and the PDN, the developed approach is general enough to also model thermal impacts on the power dissipation in the inductor cores and the buck converter chip.

Original publication




Conference paper

Publication Date



65 - 67